Custom Glass Components
Though we can achieve most any format from standard sheet glass, custom components often require specialty glass materials like Fused Silica, BK7 and other Optical Glass. These Materials can take the form of Blocks, Pressings, Cores or Plates and require additional steps to create suitable substrate for further processing. At Coresix, we have the tools and experience to convert any format of raw material into a finished component of your specifications.
For standard sheet glass materials, Coresix has a range of Precision Mechanical Scribe tables to meet most size requirements. Bulk materials are converted to appropriate blanks and, if necessary, can be further cut using the scribe process or Water Jet for intricate shapes. Often, processing (including lapping, polishing, optical coating, etc.) is more cost effectively performed on a larger part, which can then be cut and formed to the final dimensions.
Custom components will often require custom thickness or other characteristics (flatness, parallelism, etc) not available in standard material formats. Coresix maintains a variety of Single-Side Lapping and Double-Side Lapping processes with sufficient capacity to produce parts to your unique specifications in any qualities.
Once lapped to thickness (and other requirements), whether as a substrate or in finished format, the surface and subsurface damage must be removed to bring the glass back to a clear state. We have an array of Double-Side Polishing processes to create surfaces from optically clear to ultra-low defect. We also offer Super Polish to achieve a smooth surface as low as 2A RMS.
Our in-house tooling department can create custom carriers to enable Ultrasonic Cleaning of nearly any format parts up to 500mm square. We have multiple cleaning lines feeding directly into a Class 100 Optical Clean Room, where parts can be inspected under the most stringent conditions and packed to maintain cleanliness to your door.
Within our Class 100 Optical Clean Room, our most advanced inspection practices can be applied to nearly any part format. While metrology (Thickness, Parallelism, Flatness, Roughness, etc.) is often performed at the substrate level, a variety of lighting conditions are employed to inspect each part visually, assuring surface quality and cleanliness requirements are met 100% of the time.
Most dimensions are limits under optimal conditions and are subject evaluation upon inquiry.
|Dimensions (Scribed Edge)||5.0mm x 5.0mm||n/a||+/- 50µm|
|Dimensions (Hand Seam)||12mm x 12mm||n/a||+/- 50µm|
|Dimensions (CNC Edge)||35mm x 35mm||n/a||+/- 25µm|
|Dimensions (Scribed Edge)||6.0mm||n/a||/- 100µm|
|Diameter (CNC Edge)||25.0mm||450.0mm||+/- 25µm|
|Feature Positioning||n/a||n/a||+/- 25µm|
|Thickness Variation (TTV)||<1µm||n/a||n/a|
|Flatness||1/10 Wave/Inch||n/a||+/- 25µm|
|Surface Roughness (RMS)||<2Å||n/a||n/a|
|Scratch and Dig||5/2||n/a||n/a|
Actual specifications will be dependent upon material, format and other factors. We will be glad to evaluate your requirements and advise the best possible process available.
Coresix has an array of processes to achieve the tightest dimensional tolerances on custom shapes and components. Our CNC grinding stations have multiple tool change capabilities, enabling low relative dimensional variation between edges and other features. We use optical CMM’s and SPC to assure dimensional specifications. In most cases, we can achieve tolerances as low as 25um.
Our in-house carrier and tool making ability enables flexibility and creativity in the types of custom parts we are able to lap and polish. Running primarily 20” platforms, we can run most parts up to 450mm in dimension. Our advanced wafer processing capabilities apply to most custom substrate, achieving thickness tolerances to +/-5um with thickness variation as low as 1um.
Achievable flatness capabilities will depend upon material, format and thickness of the custom component. Whether processing first as a larger substrate to optimize the clear aperture of the final part, or polishing in the final format, we can design the most effective process for any custom part, often achieving sub-micron flatness levels.
Whether expressed in Arc Seconds, microns of Thickness Variation (TTV) or Transmitted Wavefront Error (TWE), our processes can create near perfect parallelism between the two surfaces. Depending on the custom part format, we commonly achieve thickness variation levels less than single micron level.
Where surface roughness is a factor, our standard polishing process results in an average roughness between 4A and 7A. For critical surface roughness requirements, Coresix has developed a “Super Polish” process achieving surfaces to 2A Ra, virtually eliminating any trace of subsurface damage.
Surface quality levels can be specified in many ways including the common “Scratch and Dig” standards, Maximum Defect Size, Light Condition (under which no visible defect is permissible), etc. Though polishing is often the final step in producing low defect wafers, it is the focus of our entire process to minimize defect through handling practices and process design. We regularly produce wafers to a 5/1 scratch and dig specification.
With multiple ultrasonic cleaning lines feeding into a Class 100 Optical Clean Room and in-house tooling capabilities to make custom USW carriers, Coresix can produce the cleanest glass components in the industry. Employing a high intensity light designed to enable the inspector to detect any level of cleanliness issue, we run a secondary inspection for residue and particulate. . In addition, we always work closely with our customers to assure what they are receiving exceeds their cleanliness expectations.
With highly experienced operators in a Class 100 Optical Clean Room, Coresix can accurately and consistently verify the pristine surface conditions we create in our process. By using an appropriate light source, specifically calibrated for the surface condition to which we are inspecting, we can establish spec limitations to the highest standards and meet them reliably in high volume production.
Custom components often require a custom and creative packaging solution. From clean room tissue wrapping and packaging to custom designed, non-contact alternatives, we consider the part specification, cleanliness requirements and unique customer needs to develop the most effective packaging option for custom components.