Schott® Borofloat® 33 Borosilicate Wafers
The performance requirements for wafers used for anodic bonding or as a carrier in wafer thinning processes are mainly determined by their ability to perfectly match those of the silicon wafer to which they shall be bonded. Well-adapted thermal expansion behavior is as important as excellent flatness and process robustness. BOROFLOAT 33 glass wafers provide these along with exceptionally high UV transmission.
Glass Wafer Options
Coresix produces Schott® BOROFLOAT 33 wafers to all SEMI Standards including dimensional, flat and notch specifications. In addition, we offer custom specifications designed to your unique needs including, alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or other details critical to your application.
||50.8, 76.2, 100, 150, 200, 300, 450
||+/- 50 μm
||.7, 1.1, 1.75, 2.25, 2.75, 3.3
||Custom .45mm - 1.1mm
||+/- 5 μm
|Thickness Variation (TTV)
|Scratch and Dig
||λ per Inch TIR
||λ/10 per Inch TIR