Willow Glass Fabrication Process
Cutting
The ultimate strength and flexibility of thin glass is dependent upon a clean, defect free edge. Our mechanical scribe process has been developed to a precise protocol of blade type, angle, pressure, scribe depth and speed to create the most pristine edge conditions possible. These parameters are closely monitored, controlled and tested throughout every job. With multiple scribe tables, we can cut parts as small as 5x5mm and as large as 1300x2600mm.
CNC Edging
Coresix has developed the unique process of edge grinding glass as thin as 100um. As such, we can produce wafers with SEMI Standard Flats and Notches as well as other featured thin glass components.
Cleaning
With custom designed carriers and modified ultrasonic settings, Coresix is capable of producing extremely clean surfaces on ultra-thin glass. We can ultrasonically clean glass as thin as 100um and up to 350mm square.
Packaging
Getting ultra-thin glass to its destination undamaged is a challenge with which Coresix has extensive experience. We use medical foam interleaf for its relative cleanliness and absorptive protection. From re-spooling of large substrate to custom crates and packaging, we can design packaging solutions for nearly any thin glass format.
Dimensional Specifications
Most dimensions are limits under optimal conditions and are subject evaluation upon inquiry.
| Attribute | Minimum | Maximum | Tolerance |
|---|---|---|---|
| Thickness | 100µm | 200µm | +/- 2µm |
| Thickness Tolerance | n/a | n/a | +/-10% |
| Dimensions (Scribed Edge) | 5.0mm x 5.0mm | 1300mm x 2600 mm | +/- 50µm |
| Diameter (Scribed Edge) | 6.0mm | 1200mm | +/-100µm |
| Diameter (CNC Edge) | 100.0mm | 300.0mm | +/-25µm |
| Corner Radius (Scribed Edge) | 6.0mm | n/a | +/-500µm |
| Corner Radius (CNC Edge) | 2.0mm | n/a | +/-100µm |
| Thickness Variation (TTV) | n/a | <10% | n/a |
| Scratch and Dig | 5/2 | 1.5K Lux (Standard) | n/a |
| Ultrasonic Cleaning | 50mm x 50mm | 350mm x 350mm | n/a |
Flexibility * Dependent upon Thickness and Format
Actual specifications will be dependent upon material, format and other factors. We will be glad to evaluate your requirements and advise the best possible process available.
Capabilities
Dimensional
With little edge variation due to thickness, in most cases our dimensional capabilities are the true mechanical tolerances of +/-50um. Maximum dimensions are limited only by the 1300mm width of the spool. For Willow Glass Wafers and other small components, CNC grinding of Flats, Notches and other features are held well within SEMI tolerances and are verified with Optical CMM.
Thickness
Though Coresix does not run processes effecting Willow Glass thickness, tolerances and variation are well controlled within the production process, typically running well below the manufacturers specification of 10%.
Flexibility
If your intended application for Willow Glass™ involves bending of the substrate, it is essential to understand Compression vs. Tension and orient your part accordingly.
Though Coresix has established and regularly tests our scribe process to maximize edge quality and resulting strength, bending the glass toward the scribe side, thereby “compressing” the micro-fractures created by the scribe, will result in the strongest condition.
Coresix identifies the compression side as part of our standard packaging procedure.
Importance of Orientation
If your intended application for Willow Glass™ involves bending of the substrate, it is essential to understand Compression vs. Tension and orient your part accordingly.
Though Coresix has established and regularly tests our scribe process to maximize edge quality and resulting strength, bending the glass toward the scribe side, thereby “compressing” the micro-fractures created by the scribe, will result in the strongest condition.
Coresix identifies the compres-sion side as part of our stan-dard packaging procedure.
Willow Glass Packaging
For full details on the process, click on the key word…
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