Glass Lapping Process
Single Side Lapping
Though we run primarily double-side lappers, Coresix has developed a proprietary process of single-side lapping on double-side machines enabling far better thickness control, parallelism and flatness on thin substrate. Where our double-side lapping process is limited to 450um, we can single-side lap as low as 100um in thickness.
Double Side Lapping
Our primary means of surface grinding, double-side lapping produces far superior thickness, flatness and parallelism results than the typical single-side process. Coresix has a long history and extensive experience in machine conditioning and process design to achieve what others cannot. Our 20" platforms can accommodate parts as large as 450mm and as thin as 450um.
Glass Thinning
For wafer applications requiring characteristics not available in the raw glass form including thickness, thickness tolerance, thickness variation, flatness and parallelism, these critical specifications are established early in the fabrication process through double-side lapping. We run multiple platforms and variations of the lapping process to consistently meet the most stringent of these requirements from small volume R&D to high volume production.
Common Terms for Lapping
Lapping Capabilities
| Lapping | Minimum | Maximum | Tolerance |
|---|---|---|---|
| Flatness | 1/10 Wave | NA | NA |
| Bow/Warp | <1um/Inch | NA | NA |
| TTV | NA +/-1um | ||
| Thickness | 200um | NA | +/-5um |
| Size | 10mm | 300mm | +/-0.10mm |
