Corning® Eagle XG® Glass Wafers
Material Description
Corning® EAGLE XG® glass wafers deliver dimensional stability and exceptionally clean, smooth and flat surfaces. The Alkaline earth boro-aluminosilicate wafer composition does not contain added heavy metals, reducing the environmental impact of manufacturing. These wafers also feature exceptional thinness, helping to eliminate the potential environmental and health hazards associated with panel thinning.
Wafer Options
Coresix produces Eagle XG® wafers to all SEMI Standards including dimensional, flat and notch specifications. In addition, we offer custom specifications designed to your unique needs including, alignment marks, holes, pockets, edge profile, thickness, flatness, surface quality, cleanliness or any other details critical to your application.
Wafer Specifications
| Attribute |
Standard |
Best |
| Diameter |
50.8, 76.2, 100, 150, 200, 300, 450 |
Custom Diameters |
| Diameter Tolerance |
+/- 200μm |
+/- 50 μm |
| Thickness |
.7, 1.1, 1.75, 2.25, 2.75, 3.3 |
Custom .45mm - 1.1mm |
| Thickness Tolerance |
+/- 5% |
+/- 5 μm |
| Thickness Variation (TTV) |
<20μm |
<1μm |
| Scratch and Dig |
60/40 |
5/2 |
| Roughnes (RMS) |
<7Å |
<3Å |
| Warp |
<400μm |
<30μm |
| Flatness |
λ per Inch TIR |
λ/10 per Inch TIR |
